Stress monitoring and analysis using lock-in thermography
Stress monitoring and analysis using lock-in thermography
复制标题
使用锁定热成像仪进行应力监测和分析
DOI：
10.1784/insi.2010.52.9.470
复制
发表时间：
2010
期刊：
影响因子：
1.1
通讯作者：
K. Mukherjee
中科院分区：
文献类型：
--
作者：
S. George;S. Goravar;D. Mishra;M. Shyamsunder;Prashant Sharma;G. Padmashree;Pravin Kumar;P. Brémond;K. Mukherjee
提出了一种基于热法和锁定原理的先进的无损评估技术，称为热弹性应力分析(TSA)，用于精确的应力测量。传统上，安装在感兴趣部件上的应变计被用来间接测量应力。在本文中，我们描述了热弹性应力分析技术在碳/环氧复合材料试件动态加载下的应力测量应用。描述了该技术与应变计相比的优点。文中还介绍了将TSA结果映射到CAD模型以及将应力与有限元模拟结果进行比较的方法。
An advanced non-destructive evaluation technique based on a thermal method and lock-in principles, known as thermoelastic stress analysis (TSA), is proposed for accurate stress measurements. Traditionally, strain gauges mounted on components of interest are used to measure stresses indirectly. In this paper, we describe the application of a thermoelastic stress analysis technique to a carbon-epoxy composite sample under dynamic loading to measure stresses. The advantages of this technique over strain gauges are described. The paper also describes methods for mapping of TSA results on CAD models and comparing the stresses with results obtained through finite element modelling.