Creep damage modeling based on ultrasonic velocities in copper
Creep damage modeling based on ultrasonic velocities in copper
复制标题
基于铜中超声波速度的蠕变损伤建模
DOI:
10.1016/s0020-7683(96)00110-2
复制
发表时间:
1997
影响因子:
3.6
通讯作者:
M. Hirao
中科院分区:
文献类型:
--
作者:
T. Morishita;M. Hirao
We measured the ultrasonic velocities and the porosity for pure copper samples subjected to the intergranular creep process. The ultrasonic velocities decreased and their anisotropy developed as the creep advanced. We study a double composite model implied by photomicrographic observations and calculated the transversely isotropic effective stiffness. In this model, spherical voids are uniformly distributed within oblate ellipsoidal volume elements. These ellipsoids are randomly embedded in an isotropic copper matrix with an axisymmetrical distribution of the minor axes around the stress direction. Incorporation of the unperturbed velocities, the porosity, and the ellipsoid aspect ratio into the modeling calculation provides the basis features of the damage morphology: the void volume fraction (in the ellipsoids) and the lowest-order expansion coefficients of the orientation distribution function (ODF). Comparison between the calculated and measured velocities was quite satisfactory, showing the validity of this micromechanical modeling.
影响因子:
4.5
作者:
J. Bussière
通讯作者:
J. Bussière