Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
Void Evolution in Sub-100-Micron Sn-Ag Solder Bumps during Multi-reflow and Aging and its Effects on Bonding Reliability
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DOI：
10.1007/s11664-007-0359-2
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发表时间：
2008-03
影响因子：
2.1
通讯作者：
Xiaoqin Lin;L. Luo
中科院分区：
文献类型：
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作者：
Xiaoqin Lin;L. Luo
研究了Sn-3.0Ag焊料凸点在电镀Cu上的界面空洞的演变及其对键合可靠性的影响。结果表明，体积收缩导致在多次回流过程中形成空洞，而柯肯达尔效应导致在老化过程中形成空洞。厚的η相和Cu 6Sn 5晶界处的空洞促进了ε相中空洞的长大。虽然空洞的形成对焊点的剪切强度有轻微的削弱作用，但空洞对焊点的键合可靠性是一个威胁。
The evolution of voids in the interfacial region of electroplated Sn-3.0Ag solder bumps on electroplated Cu and its effects on bonding reliability were studied. Results show that volume shrinkage resulted in void formation during multi-reflow, while the Kirkendall effect led to void formation during aging. A thickη-phase and voids at the boundaries among Cu6Sn5grains promoted the void growth in theε-phase. Though the formation of voids had a trivial weakening effect on the shear strength of the solder joints, the voids were a threat to the bonding reliability of solder bumps.