Fracture toughness enhancement via sub‐micro silver‐precipitation in silica glass fabricated by spark plasma sintering
Fracture toughness enhancement via sub‐micro silver‐precipitation in silica glass fabricated by spark plasma sintering
复制标题
通过放电等离子烧结制备的石英玻璃中亚微米银沉淀增强断裂韧性
DOI：
10.1111/jace.18214
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发表时间：
2021
影响因子：
3.9
通讯作者：
Shinozaki Kenji
中科院分区：
文献类型：
--
作者：
Liu Lei;Shinozaki Kenji
采用放电等离子烧结法（SPS）制备了亚微米级的二氧化硅（SiO2）玻璃中沉淀银（Ag），并对其显微结构、力学性能和热导率进行了研究。通过硝酸银（AgNO 3）的分解原位形成的Ag亚微米颗粒均匀地分布在SiO2基质中。通过Ag颗粒的沉淀，由于Ag颗粒的延展性，观察到更大的稳态蠕变变形和塑性变形。此外，在裂纹扩展过程中观察到裂纹桥接和Ag颗粒的拔出。结果表明，SiO2玻璃的断裂韧性随Ag含量的增加而提高。在1200°C下烧结的具有1.4体积% Ag的样品显示出2.15 ± 0.2MPa m1/2的最高韧性值。在较高温度下烧结的样品中较大的Ag颗粒倾向于容易变形，从而导致较大的延展性。此外，Ag颗粒的掺入改善了热导率。
Sub‐micro silver (Ag) precipitated in silica (SiO2) glass was prepared via spark plasma sintering (SPS), and the microstructure, mechanical properties, and thermal conductivity were investigated. The in situ formation of Ag sub‐micro particles through decomposition of silver nitrate (AgNO3) was homogeneously distributed within the SiO2matrix. By precipitation of Ag particles, larger steady‐state creep deformation and plastic deformation were observed owing to the ductility of the Ag particles. Moreover, crack bridging and pull‐out of Ag particles were observed during crack propagation. As a result, the fracture toughness of SiO2glass improved with increasing Ag content. The sample with 1.4 vol% Ag sintered at 1200°C showed the highest toughness value of 2.15 ± 0.2 MPa m1/2. Larger Ag particles in the samples sintered at higher temperatures tend to deform easily, resulting in larger ductility. In addition, incorporation of Ag particles improved thermal conductivity.