Influence of rolling temperature on microstructural evolution and mechanical behavior of AZ31 alloy with accumulative roll bonding

Influence of rolling temperature on microstructural evolution and mechanical behavior of AZ31 alloy with accumulative roll bonding
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轧制温度对累积轧制AZ31合金显微组织演变和力学行为的影响

DOI:
10.1016/j.msea.2019.03.047
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发表时间:
2019-04-29
影响因子:
6.4
通讯作者:
Lu, Jian
Lu, Jian
中科院分区:
材料科学1区
文献类型:
--
作者:
Rao, Xixin;Wu, Yunpeng;Lu, Jian

文献摘要

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研究了轧制温度对AZ31合金累积轧制结合(ARB)的影响。结果表明:在450℃温度下,ARB过程发生动态再结晶,沿剪切应力方向形成剪切带,呈现出从表面到内部宽度减小的形状,ARB过程后的应变硬化使强度提高,延伸率降低是由于内部裂纹造成的;显微硬度随轧制温度的升高而降低;由于剪切带的形成,外板的显微硬度低于内板。提高ARB温度可提高界面结合强度。界面成键是界面两侧发生动态再结晶的过程,细小的再结晶晶粒不断吞噬并取代原有晶粒,直至界面湮灭。裂纹在剪切带内萌生,并沿剪切带扩展。
The effect of rolling temperature on AZ31 alloy with accumulative roll bonding (ARB) had been investigated. The results showed that dynamic recrystallization occurs and forming shear bands in the direction of shear stress, exhibit the shape that width decreases from the surface to the inside when ARB at 450 degrees C. Strength was increased result by strain hardening after ARB process, with compromise of elongation was attributable to the internal crack. Microhardness was enhanced after ARB, while decreasing with the increase rolling temperature. Because of the formation of shear band, microhardness of outer plate was lower than inner plate. Interface bonding strength was increased by improving ARB temperature. Interface bonding is a process in which dynamic recrystallization occurs on both sides of the interface, fine recrystallized grains constantly swallowed and replace the original grains until the interface is annihilated. Crack initiation in shear band and extends along the shear band.