Two-dimensional strain mapping in semiconductors by nano-beam electron diffraction employing a delay-line detector
Two-dimensional strain mapping in semiconductors by nano-beam electron diffraction employing a delay-line detector
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DOI:
10.1063/1.4927837
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发表时间:
2015-08-17
影响因子:
4
通讯作者:
Potapov, Pavel
中科院分区:
文献类型:
--
作者:
Mueller-Caspary, Knut;Oelsner, Andreas;Potapov, Pavel
A delay-line detector is established for electron detection in the field of scanning transmission electron microscopy (STEM) and applied to two-dimensional strain mapping in Si-based field effect transistors. We initially outline the functional principle of position-sensitive delay-line detection, based on highly accurate time measurements for electronic pulses travelling in meandering wires. In particular, the detector is a single-counting device essentially providing an infinite time stream of position-resolved events so that acquisition speed is not hindered by detector read-outs occurring in conventional charge-coupled devices. By scanning the STEM probe over stressor-and gate regions of a field effect transistor on a 100 x 100 raster, 10 000 diffraction patterns have been acquired within 3-6.5 min, depending on the scan speed. Evaluation of the 004 and 220 reflections yields lateral and vertical strain at a spatial resolution of 1.6 nm. Dose-dependent strain precisions of 1.2 - 1.8 x 10(-3) could be achieved for frame times of 40 and 20 ms, respectively. Finally, the detector is characterised as to quantum efficiency and further scopes of application are outlined. (C) 2015 Author(s).