Characterization of interfacial morphology of low temperature, low pressure Au-Au thermocompression bonding
Characterization of interfacial morphology of low temperature, low pressure Au-Au thermocompression bonding
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DOI：
10.7567/jjap.57.02bc03
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发表时间：
2018-02-01
影响因子：
1.5
通讯作者：
Iyer, Subramanian S.
中科院分区：
文献类型：
--
作者：
Goorsky, Mark S.;Schjolberg-Henriksen, Kari;Iyer, Subramanian S.
金-金热压键合是一种多功能技术，具有广泛的应用前景。我们研究了在低温（150-250℃）和低键合压力（> - 3 MPa）短时间（15分钟）下，用溅射沉积的Au-Au薄膜进行Au-Au键合。低温和短时间的结合对于涉及密封和包装缩放的应用是重要的。Au膜的初始表面粗糙度在3 ~ 5 nm范围内，峰谷高20 ~ 30nm，横向相关长度> ~ 400 nm。对于在150℃下结合的样品，结合界面处的空洞形貌与初始表面粗糙度有关。当温度升高时，孔洞的形态有所不同，孔洞长度（沿界面方向）明显减小，而孔洞高度（垂直于界面方向）增大。这些结果可以理解为，随着键合温度的升高，表面金的扩散率增加，屈服应力和弹性模量降低。(C) 2018日本应用物理学会
Au-Au thermocompression bonding is a versatile technique of high interest for a variety of applications. We have investigated Au-Au bonding using sputter deposited Au films under conditions of low temperature (150-250 degrees C) and low bonding pressure (> 3 MPa) for short times (15 min). The combination of low temperature and short times is important for applications involving both hermetic sealing and packaging scaling. The initial surface roughness of the Au film was in the 3-5 nm range with peak-to-valley heights of 20-30nm and a lateral correlation length of > 400 nm. For samples bonded at 150 degrees C, the void morphology at the bonded interface was related to the initial surface roughness. The void morphology was different when bonding at the higher temperatures: the void length (along the bonded interface) decreased significantly but the void height (perpendicular to the interface) increased. These results can be understood in terms of a combination of increased surface Au diffusivity and decreased yield stress and elastic modulus with increased bonding temperature. (C) 2018 The Japan Society of Applied Physics