First demonstration of high density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon substrate
First demonstration of high density optical interconnects integrated with lasers, optical modulators and photodetectors on a single silicon substrate
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DOI：
10.1364/oe.19.00b159
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发表时间：
2011-09
期刊：
影响因子：
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通讯作者：
Y. Urino;Takanori Shimizu;M. Okano;N. Hatori;M. Ishizaka;Tsuyoshi Yamamoto;T. Baba;T. Akagawa;S. Akiyama;Tatsuya Usuki;D. Okamoto;M. Miura;M. Noguchi;J. Fujikata;D. Shimura;H. Okayama;T. Tsuchizawa;Toshifumi Watanabe;K. Yamada;S. Itabashi;E. Saito;Takahiro Nakamura;Y. Arakawa
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文献类型：
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作者：
Y. Urino;Takanori Shimizu;M. Okano;N. Hatori;M. Ishizaka;Tsuyoshi Yamamoto;T. Baba;T. Akagawa;S. Akiyama;Tatsuya Usuki;D. Okamoto;M. Miura;M. Noguchi;J. Fujikata;D. Shimura;H. Okayama;T. Tsuchizawa;Toshifumi Watanabe;K. Yamada;S. Itabashi;E. Saito;Takahiro Nakamura;Y. Arakawa
首次展示了在单个硅衬底上集成激光器、硅光调制器和锗光电探测器的光学互连。实现了5Gbps的线路比特率和3.5Tbps/cm 2的传输密度。
Optical interconnects integrated with lasers, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated for the first time. A 5 Gbps line bit rate and 3.5 Tbps/cm2 transmission density were achieved.