Thermal tuning of the interfacial adhesive layer on the band gaps in a one-dimensional phononic crystal

Thermal tuning of the interfacial adhesive layer on the band gaps in a one-dimensional phononic crystal
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一维声子晶体带隙上界面粘合层的热调节

DOI:
10.1016/j.compstruct.2017.03.092
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发表时间:
2017-07-15
影响因子:
6.3
通讯作者:
Song, J.
Song, J.
中科院分区:
工程技术1区
文献类型:
--
作者:
Li, Y.;Zhou, X.;Song, J.

文献摘要

被引文献

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声子晶体由于其人工周期结构而具有独特的声学性质。它们已被用于波导,滤波器,噪声抑制,振动控制等广泛的应用,在本文中,建立了一个分析模型的基础上的传输矩阵方法来研究的P-和SH-波的带隙的一维声子晶体由交替的两种不同的材料条由界面粘合层结合。考虑界面粘结层的温度依赖性弹性特性的分析表明了一种不同的但有效的声学能带结构热调谐方法。结果表明,随着温度从20 ℃升高到80 ℃,第一带隙宽度减小了50%以上。这些结果为声子晶体中波传播的热调谐提供了设计指导。(C)2017爱思唯尔有限公司版权所有
Phononic crystals possess unique acoustic properties due to their artificial periodic structure. They have been used in a wide range of applications such as wave guides, filters, noise suppression, vibration control, etc. In this paper, an analytic model based on the transfer matrix method is established to study the band gaps of P- and SH-waves in a one-dimensional phononic crystal consisting of alternating strips of two different materials bonded by an interfacial adhesive layer. The analysis accounting for the temperature dependent elastic property of the interfacial adhesive layer indicates a different but an effective approach for thermal tuning of the acoustic band structures. It is shown that the first band gap width may decrease over 50% as the temperature increases from 20 C-circle to 80 C-circle. These results provide design guidelines for thermal tuning of wave propagation in phononic crystals. (C) 2017 Elsevier Ltd. All rights reserved.