Non-contact batch micro-assembly by centrifugal force
Non-contact batch micro-assembly by centrifugal force
复制标题
利用离心力进行非接触式批量微组装
DOI：
10.1109/memsys.2002.984235
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发表时间：
2002
期刊：
影响因子：
--
通讯作者：
W. J. Li
中科院分区：
文献类型：
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作者：
King Wai Chiu Lai;Allan P. Hui;W. J. Li
由于微机电系统的小尺度，惯性力往往被忽略。然而，我们证明，即使微观结构的质量<1 /spl mu/g（在MUMPs poly1、poly2和Au层中，质量为250 /spl mu/m /spl乘以/ 100 /spl mu/m），这些力也可能是显著的。我们证明，在这个尺度下，质量惯性力可以克服表面力，并用于MEMS结构的非接触自组装。将离心力施加到铰链式MUMPs#31结构上，使这些结构通过向基板平面旋转90/spl度来自组装，并自动锁定到设计的锁存器上。这种批量组装技术非常快速、低成本、非接触和非破坏性。此外，我们通过在相同的MUMPs芯片上集成传感器，提供与微结构动态行为相关的无线信号，成功地表征了组装这些微结构所需的离心力。这是对表面微机械MEMS器件表面力进行定量分析的重要结果。
Due to the minute scale of MEMS, inertia forces are often neglected. However, we prove that these forces can be significant even if a microstructure's mass is <1 /spl mu/g (a 250 /spl mu/m /spl times/ 100 /spl mu/m mass with MUMPs poly1, poly2, and Au layers). We demonstrate that at this scale, mass inertia force can overcome surface forces and be used for non-contact self-assembly of MEMS structures. A centrifugal force was applied to hinged MUMPs#31 structures, causing these structures to self-assemble by rotating themselves 90/spl deg/ out of substrate plane and to lock themselves automatically to designed latches. This batch-assembly technique is very fast, low-cost, non-contact, and non-destructive. Moreover, we have successfully characterized the centrifugal forces needed to assemble these microstructures by integrating sensors on the same MUMPs chips to provide wireless signals that relate to the dynamic behavior of the microstructures. This is a very important result in terms of making feasible quantitative analyses of surface forces acting on surface micromachined MEMS devices.