Large scale W-band focal plane array for passive radiometric imaging

Large scale W-band focal plane array for passive radiometric imaging
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用于被动辐射成像的大规模 W 波段焦平面阵列

DOI:
10.1109/mwsym.1996.508532
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发表时间:
1996
期刊:
1996 IEEE MTT-S International Microwave Symposium Digest
影响因子:
--
通讯作者:
B. Allen
B. Allen
中科院分区:
--
文献类型:
--
作者:
G. Dow;D. Lo;Y. Guo;E. W. Lin;T. T. Chung;M. Biedenbender;O. Miromontes;A. Marashi;L. Yujiri;P. Lee;M. Shoucri;B. Allen

文献摘要

被引文献

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本文讨论了一种用于被动辐射成像的大规模W波段焦平面阵列的研制。我们的目标是开发一个40/spl倍/26(1040像素)FPA,以覆盖15/spl度//spl倍/10/spl度/瞬时视场。每个接收机由一个单一的直接检测MMIC,这是一个W波段高增益,宽带宽开关LNA集成肖特基势垒二极管检测器。一个1/spl倍/4焦平面组件,采用线性渐变缝隙天线,被用来作为基本的构建块的焦平面。典型的接收器温度灵敏度为0.4 K,积分时间为10 ms。首次采用自动化组装工艺大批量生产W波段MMIC模块。
This paper discusses the development of a large scale W-band focal plane array (FPA) for passive radiometric imaging application. The goal is to develop a 40/spl times/26 (1040-pixels) FPA to cover 15/spl deg//spl times/10/spl deg/ instantaneous field-of-view. Each receiver consists of a single direct detection MMIC which is a W-band high gain, wide bandwidth switched LNA with integrated Schottky barrier diode detector. A 1/spl times/4 FPA module, employing linearly tapered slot antenna, is used as the basic building block for the FPA. Typical receiver temperature sensitivity is 0.4 K with 10 ms integration time. For the first time, an automated assembly process is used to produce W-band MMIC modules in large volume.