Exploring aging deceleration in FinFET-based multi-core systems
Exploring aging deceleration in FinFET-based multi-core systems
复制标题
探索基于 FinFET 的多核系统中的老化减速
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
Diana Marculescu
中科院分区：
文献类型：
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作者：
E. Cai;Dimitrios Stamoulis;Diana Marculescu
功耗和散热问题是高性能多核系统的主要限制因素。作为当前的技术选择，FinFET被观察到在超阈值电压区域中在较高温度下具有较低的延迟，这种效应被称为温度效应反转（TEI）。虽然事实证明，随着技术积极扩展到20纳米以下的节点，系统性能可以在功率限制下得到提高，但热问题也成为整个系统生命周期中重要的可靠性问题。据我们所知，我们是第一家提供TEI和老化对具有多个电压/频率水平的FinFET多核系统性能和功耗影响的全面评估的公司。我们的实验结果表明，老化效应可以减少高达53.59%，通过利用TEI效应。基于功率和老化的组合多变量目标，这项工作提出了一种老化感知算法，称为AgingMin，以选择最佳的TEI感知电压/频率操作点，以减缓老化效应。实验结果表明，AgingMin将经典的10年系统寿命平均提高了1.61年，同时与现有的最先进的技术相比，功耗开销不到1%。
Power and thermal issues are the main constraints for high-performance multi-core systems. As the current technology of choice, FinFET is observed to have lower delay under higher temperature in super-threshold voltage region, an effect called temperature effect inversion (TEI). While it has been shown that system performance can be improved under power constraints, as technology aggressively scales down to sub-20nm nodes, thermal issues also emerge as important reliability concerns throughout the system lifetime. To the best of our knowledge, we are the first to provide a comprehensive evaluation of both TEI and aging effects on the performance and power of FinFET-based multi-core systems with multiple voltage/frequency levels. Our experimental results show that aging effects can be reduced by up to 53.59% by exploiting the TEI effect. Based on a combined multivariate objective for power and aging, this work proposes an aging-aware algorithm, dubbed AgingMin, to select the optimal TEI-aware voltage/frequency operation points for decelerating the aging effect. Experimental results show that AgingMin improves the classic 10-year system lifetime by an average of 1.61 years while introducing less than 1% power overhead when compared to existing state-of-the-art techniques.