A mathematical model of the deposition rate and layer height during electrochemical additive manufacturing
A mathematical model of the deposition rate and layer height during electrochemical additive manufacturing
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DOI：
10.1007/s00170-019-03292-2
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发表时间：
2019-02
期刊：
影响因子：
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通讯作者：
Abishek B. Kamaraj;M. Sundaram
中科院分区：
文献类型：
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作者：
Abishek B. Kamaraj;M. Sundaram
电化学增材制造（ECAM）是一种新型的非热金属增材制造技术。层高度是增材制造工艺中的重要参数，其决定了所制造部件的分辨率和质量。沉积速率的建模使得能够预测特定特征的层尺寸和沉积时间。该模型以电沉积工艺参数和水平扫描速度为输入，以沉积速率和沉积层高度为输出。电流密度的计算基于现有的模型，考虑离子传输和电极动力学。预测的沉积速率与实验结果进行了验证。结果发现，具有75%占空比的脉冲电压具有最高的沉积速率。当沉积速率在1和3 μm/s之间变化时，发现对于直径250 μm的工具，扫描速度在0.1到2 mm/s之间。扫描速度对于每个电极间间隙具有下限，低于该下限存在短路的可能性。脉冲占空比对层高度的影响在较大的极间间隙处减小。
Electrochemical additive manufacturing (ECAM) is a novel non-thermal metal additive manufacturing technology. The layer height is an important parameter in additive manufacturing processes which determines the resolution and quality of the parts manufactured. The modeling of the rate of deposition enables the prediction of the layer size and time of deposition for a particular feature. The developed model takes the electrical process parameters and the horizontal scan speed as inputs and gives the rate of deposition and deposited layer height as the output. The current density was calculated based on an existing model considering ion transport and electrode kinetics. The predicted deposition rates were validated with experimental findings. It was found that the pulsed voltage with a 75% duty cycle had the highest deposition rate. While the deposition rates varied between 1 and 3 μm/s, the scan speed was found to be between 0.1 to 2 mm/s for a diameter 250-μm tool. The scan speed had a lower limit for each interelectrode gap below which a possibility of short-circuiting exists. The influence of the pulse duty cycle on the layer height reduces at larger interelectrode gaps.