High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials
High Thermal Conductivity of Sandwich‐Structured Flexible Thermal Interface Materials
复制标题
高导热三明治结构柔性热界面材料
DOI：
10.1002/smll.202207015
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发表时间：
2023
期刊：
影响因子：
13.3
通讯作者：
Lee, Inkyu
中科院分区：
文献类型：
--
作者：
Jing, Lin;Cheng, Rui;Tasoglu, Muzaffer;Wang, Zexiao;Wang, Qixian;Zhai, Hannah;Shen, Sheng;Cohen‐Karni, Tzahi;Garg, Raghav;Lee, Inkyu
热界面对于现代电子产品中的有效热管理至关重要，特别是在柔性电子产品和软机器人等新兴领域，这些领域要求界面材料除了具有高的热性能之外还必须柔软和柔性。在这里，开发了一种新型三明治结构热界面材料（TIM），同时具有创纪录的低热阻和高柔性。采用频域热反射（FDTR）来研究夹层结构的整体热性能。作为这种三明治的核心，垂直排列的铜纳米线（CuNW）阵列保留了其高的固有热导率，通过厚的3D石墨烯（3DG）涂层进一步提高了60%。在器件组装过程中，顶部和底部的薄铜层在保护纳米线方面起着关键作用。通过自下而上的制造工艺，实现了石墨烯涂层CuNW与顶层/底层之间的良好接触，从而使界面电阻最小化。总的来说，夹层的热阻被确定为低至~0.23 mm 2K W−1。这项工作研究了具有超低热阻的新一代柔性热界面材料，因此为各种电子产品的先进热管理带来了巨大的希望。
Thermal interfaces are vital for effective thermal management in modern electronics, especially in the emerging fields of flexible electronics and soft robotics that impose requirements for interface materials to be soft and flexible in addition to having high thermal performance. Here, a novel sandwich‐structured thermal interface material (TIM) is developed that simultaneously possesses record‐low thermal resistance and high flexibility. Frequency‐domain thermoreflectance (FDTR) is employed to investigate the overall thermal performance of the sandwich structure. As the core of this sandwich, a vertically aligned copper nanowire (CuNW) array preserves its high intrinsic thermal conductivity, which is further enhanced by 60% via a thick 3D graphene (3DG) coating. The thin copper layers on the top and bottom play the critical roles in protecting the nanowires during device assembly. Through the bottom‐up fabrication process, excellent contacts between the graphene‐coated CuNWs and the top/bottom layer are realized, leading to minimal interfacial resistance. In total, the thermal resistance of the sandwich is determined as low as ~0.23 mm2K W−1. This work investigates a new generation of flexible thermal interface materials with an ultralow thermal resistance, which therefore renders the great promise for advanced thermal management in a wide variety of electronics.