Assessment of high-heat-flux thermal management schemes
Assessment of high-heat-flux thermal management schemes
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DOI：
10.1109/itherm.2000.866802
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发表时间：
2000-05
期刊：
影响因子：
--
通讯作者：
I. Mudawar
中科院分区：
文献类型：
--
作者：
I. Mudawar
本文介绍了高热流密度热管理的最新研究进展。讨论了池沸腾、可拆卸散热器、通道流动沸腾、微通道和微通道散热器、射流冲击和喷雾等冷却方案，并就散热潜力、可靠性和包装问题进行了比较。研究表明，虽然可以根据不同应用的具体需要定制不同的冷却方案，但在确定最合适的冷却方案时，系统考虑因素始终起着至关重要的作用。它还表明，在过去的二十年里，已经积累了广泛的基础电子冷却知识。然而，现在对硬件创新的需求越来越大，而不是对这些基础研究的干扰。这些创新的一个例子是军用航空电子设备的冷却，电子冷却文献的研究成果使新一代冷却硬件的开发成为可能，与当今尖端的航空电子设备冷却方案相比，这种硬件有望在散热方面增加数量级。
This paper explores the recent research developments in high-heat-flux thermal management. Cooling schemes such as pool boiling, detachable heat sinks, channel flow boiling, micro-channel and mini-channel heat sinks, jet-impingement, and sprays, are discussed and compared relative to heat dissipation potential, reliability, and packaging concerns. It is demonstrated that, while different cooling options can be tailored to the specific needs of individual applications, system considerations always play a paramount role in determining the most suitable cooling scheme. It is also shown that extensive fundamental electronic cooling knowledge has been amassed over the past two decades. Yet there is now a growing need for hardware innovations rather than perturbations to those fundamental studies. An example of these innovations is the cooling of military avionics, where research findings from the electronic cooling literature have made possible the development of a new generation of cooling hardware which promise order of magnitude increases in heat dissipation compared to today's cutting edge avionics cooling schemes.