Nano-microscale moulding of some metal plates with high strength Ni-W alloy moudls

Nano-microscale moulding of some metal plates with high strength Ni-W alloy moudls
复制标题

高强度镍钨合金模具某些金属板的纳米微尺度成型

DOI：
10.1007/s00542-013-2005-7
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发表时间：
2014
期刊：
Micro. Technol.
影响因子：
--
通讯作者：
T. Nabeshima and Y. Yokoyama
T. Nabeshima and Y. Yokoyama
中科院分区：
--
文献类型：
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作者：
T. Yamasaki;M. Yamada;H. Adachi;T. Nabeshima and Y. Yokoyama

文献摘要

相似文献

高强度纳米晶和非晶Ni-14-24 at.用电沉积法制备了抗拉强度约为3GPa的% W合金。制备了由线宽为700 nm和300 nm、高度为200 nm的线结构和空间结构组成的纳微米Ni-W合金模具镶块。用Ni-W合金镶块对纯Al、SUS-316L不锈钢和Zr 69 Cu 16 Ni 5 Al 10大块非晶合金板材进行了室温高压应力成形。在纯Al的情况下，在约350 MPa的模制应力下，实现了完全模制，其中约200 nm的深度约等于插入件的高度。重复模塑200次循环未导致Ni-W合金内衬发生任何明显变化或降解。然而，在SUS-316L不锈钢的情况下，在约1GPa的模制应力下，未实现纳米-微米尺度的模制。这可能是由于SUS-316L不锈钢在塑性变形期间的高应变硬化能力。对于具有约1.5GPa的高屈服应力且无应变硬化能力的Zr 69 Cu 16 Ni 5 Al 10块体非晶合金，在约2GPa的高模压应力下几乎可以成功地实现完全模压。
High strength nanocrystalline and amorphous Ni-14–24 at. % W alloys with their tensile strengths of about 3 GPa have been prepared by electrodeposition. Nano-microscale Ni–W alloy mould inserts, consisting of line and space structures with the line-widths of 700 and 300 nm and the height of 200 nm, were fabricated. High compression stress moulding of some metal plates of pure-Al, SUS-316L stainless steel and Zr69Cu16Ni5Al10bulk metallic glass with the Ni–W alloy inserts was carried out at room temperature. In the case of the pure-Al under moulding stress of about 350 MPa, full moulding was achieved with the depths of about 200 nm approximately equal to the height of the inserts. Repeat moulding of 200 cycles did not cause any noticeable change or degradation of the Ni–W alloy inserts. In the case of the SUS-316L stainless steel under the moulding stress of about 1 GPa, however, the nano-microscale moulding was not achieved. This may be due to the high strain hardening ability of the SUS-316L stainless steel during plastic deformation. In the case of the Zr69Cu16Ni5Al10bulk metallic glass with a high yielding stress of about 1.5 GPa and no strain hardening ability, full moulding was almost achieved successfully under the high moulding stress of about 2 GPa.