Stretchable electronics manufacturing and application

Stretchable electronics manufacturing and application
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可拉伸电子产品制造及应用

DOI:
10.1109/estc.2010.5642945
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发表时间:
2010
期刊:
3rd Electronics System Integration Technology Conference ESTC
影响因子:
--
通讯作者:
A. Ostmann
A. Ostmann
中科院分区:
--
文献类型:
--
作者:
T. Loher;M. Seckel;A. Ostmann

文献摘要

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近年来,能够在一定程度上被拉伸的电子系统的制造已经吸引了越来越多的关注。作为一般的动机,这种电子器件与传统电子器件相比将顺应自由形式的形状,例如人体表面。已经证明了实现这种系统的一些不同的成功方法。到目前为止,已经解决了可拉伸电子器件的各个方面,从可拉伸Si检测器阵列到具有集成商业组件的大规模、低成本可拉伸系统。在欧盟STELLA项目中,已经开发了后一类制造技术。这些技术目前正在进一步发展,重点放在项目PLACE-IT的光学应用。这两个项目的基本原理是使用传统的印刷电路板技术,用于制造可拉伸的布线基板,在其上组装和嵌入组件。可拉伸性由部件和橡胶状聚合物基底聚氨酯之间的Cu互连的曲折布局来解释,而不是在常规柔性印刷中使用的聚酰亚胺。在本论文中,将讨论可拉伸基板的制造工艺的基本特征。选定的材料,工艺参数和设计方面将解决相对于选定的目标应用。可伸缩系统的可靠性要求在很大程度上取决于应用场景。除了明显的拉伸失效、循环拉伸和弯曲测试外,还需要清洁和洗涤方面的稳健性。全面的可靠性标准尚待确定。本文将简要介绍可靠性评估。将介绍和讨论使用可拉伸电子器件的一些已实现的应用。将强调制造技术及其产品的多功能性。对不同应用领域的潜在影响将得到强调,例如电子集成到纺织品和汽车应用中。
In the recent years the fabrication of electronic systems that can to a certain extent be stretched has attracted increasing attention. As general motivation such electronics will in contrast to conventional electronics be compliant with free form shapes, as for example the human body surface. A number of different successful approaches to realize such systems have been demonstrated. Thus far various aspects of stretchable electronics have been addressed ranging from stretchable Si detector arrays to large scale, low cost stretchable systems with integrated commercial components. Within the EU project STELLA the latter types of fabrication technologies have been developed. These technologies are presently further developed with focus on optical applications in the project PLACE-it. The rationale of both projects is the use of conventional printed circuit board technologies for the fabrication of stretchable wiring substrates onto which components are assembled and embedded. Stretchability is accounted for by a meandering layout of the Cu-interconnects between components and the rubber like polymeric substrate polyurethane, instead of polyimide which is used in conventional flex-prints. In the present paper basic features of the fabrication process for stretchable substrates will be discussed. Selected materials, process parameters and design aspects will be addressed with respect to selected target applications. Reliability requirements of stretchable systems are very much dependent on the application scenario. Besides obvious stretch-to-failure, cyclic stretching and bending tests, also robustness with respect to cleaning and washing is required. Comprehensive reliability standards are yet to be defined. In the present paper a brief overview of reliability assessment will be given. A few of the realized applications using stretchable electronics will be presented and discussed. The versatility of the fabrication technology and its products will be emphasized. The potential impact on different application fields will be highlighted, as for example electronic integration into textiles and in automotive applications.