Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
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高温环境下纳米银浆料的烧结键合工艺及接头性能
DOI：
10.1155/2016/5284048
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发表时间：
2016
影响因子：
--
通讯作者：
Zhou Y. Norman
中科院分区：
文献类型：
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作者：
Yan Jianfeng;Zhang Dongyue;Zou Guisheng;Liu Lei;Bai Hailin;Wu Aiping;Zhou Y. Norman
基于多元醇法和随后的离心浓缩制备银纳米颗粒浆料。研究了不同键合压力下银纳米颗粒浆料的烧结键合过程。随着粘合压力从0 MPa增加到7.5 MPa，接头强度增加。这是因为较高的辅助键合压力有利于相邻颗粒之间颈部尺寸的增长，并形成更致密的烧结银层。 10 MPa下的接合强度低于7.5 MPa下的接合强度，这可能是由于烧结Ag层中有机成分的残留所致。通过在200-350℃的温度范围内热处理50小时来评估在高温环境下与Ag纳米颗粒浆料粘合的接头性能。结果表明，高温储存后，Ag纳米颗粒焊料接头的力学性能优于Pb95Sn5焊料接头。
Ag nanoparticle paste is prepared based on the polyol method and subsequent concentration by centrifuging. The sintering bonding process using Ag nanoparticle paste at different bonding pressures is studied. The joint strengths are increased as the bonding pressure increases from 0 MPa to 7.5 MPa. This is due to the fact that the higher assistant bonding pressure is beneficial to the growth of neck size between the adjacent particles and forms denser sintered Ag layers. The joint strength bonded under 10 MPa is lower than that bonded under 7.5 MPa, which may be due to the residue of organic component in the sintered Ag layer. The joint properties bonded with Ag nanoparticle paste in high temperature environment are evaluated by heat treatments at temperatures ranges of 200-350°C for 50 hours. The results show that the mechanical properties of joint with Ag nanoparticle paste are better than the joint with Pb95Sn5 solder after storage at high temperatures.