The ISGRI CdTe gamma-ray camera: first steps
The ISGRI CdTe gamma-ray camera: first steps
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ISGRI CdTe 伽马射线相机：第一步
DOI：
10.1016/s0168-9002(99)01228-0
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发表时间：
2000
影响因子：
1.4
通讯作者：
M. Rouger
中科院分区：
文献类型：
--
作者：
O. Limousin;C. Blondel;J. Cretolle;H. Dzitko;P. Laurent;F. Lebrun;J. Leray;M. Arques;N. Baffert;F. Mathy;A. Noca;P. Trystram;P. Villard;P. Baron;E. Delagnes;M. Rouger
INTEGRAL卫星上的伽马射线望远镜IBIS具有编码掩模孔径、主动和被动屏蔽以及两个探测器阵列。第一个（ISGRI）是在室温下工作的16384个CdTe探测器（4× 4 mm大，2 mm厚）的组件。ISGRI涵盖IBIS能量范围（15 keV-10 MeV）的较低部分（15 keV-1 MeV）。探测器被安排在多单元上，每个单元包括16个晶体，连接到它们的前端电子设备（ASIC）。八个独立的ISGRI模块中的每一个都由128个多单元组成。ASIC包含一个低噪声电荷敏感型ADC，除了标准脉冲高度测量外，还具有脉冲上升时间测量功能。这允许基于电荷漂移时间计算电荷损失校正。应用此校正后，在122 keV的光谱分辨率约为7.5%，获得与ASIC。今天，16个多晶电池已经安装在第一个代表性的ISGRI模块上。该模块已与整个国际地球静止轨道研究所的数据处理电子系统连接，形成国际地球静止轨道研究所的工程模型。在介绍了科学背景之后，本文描述了ISGRI的设计，特别强调了探测器、多电池性能和模块组装。
The gamma-ray telescope IBIS, on board the INTEGRAL satellite, features a coded-mask aperture, active and passive shields and two detector arrays. The first one (ISGRI) is an assembly of 16384 CdTe detectors (4×4mm large, 2mm thick) operating at room temperature. ISGRI covers the lower part (15keV–1MeV) of the IBIS energy range (15keV–10MeV). Detectors are arranged on polycells, each including 16 crystals, connected to their front-end electronics (ASICs). Each of the eight independent ISGRI modules are made of 128 polycells. The ASICs contain a low noise charge-sensitive preamplifier and feature pulse rise-time measurement in addition to the standard pulse height measurement. This permits to compute a charge loss correction based on the charge drift time. After application of this correction, a spectral resolution around 7.5% at 122keV is obtained with the ASICs. Today, 16 polycells have been mounted on the first representative ISGRI module. This module has been interfaced with the entire ISGRI data-processing electronics and forms the engineering model of ISGRI. After a presentation of the scientific context, this paper describes the ISGRI design with particular emphasis on the detectors, the polycells performances and the module assembly.