Material Processing Using Femtosecond Lasers: Repairing Patterned Photomasks
Material Processing Using Femtosecond Lasers: Repairing Patterned Photomasks
复制标题
使用飞秒激光器进行材料加工：修复图案光掩模
DOI：
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发表时间：
2006
期刊：
影响因子：
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通讯作者：
A. Wagner
中科院分区：
文献类型：
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作者：
R. Haight;Peter P. Longo;A. Wagner
超快激光脉冲的使用正在以深刻的方式对材料加工产生影响。使用飞秒脉冲的“加工”提供了优于纳秒脉冲的相当大的优势，例如亚衍射限制的材料烧蚀，其中烧蚀的光斑尺寸低于当较长脉冲被聚焦到由光学物理决定的最小光斑尺寸时可实现的尺寸。这些特性已经被用来解决半导体工业中的一个关键问题，即图案化光掩模的修复。我们将描述如何飞秒激光烧蚀的基本原理已实施的机器设计修复光掩模。我们还将描述实验设计的存款铬金属到熔融石英基板上使用100 fs，400 nm的光脉冲在大气压下。吸附在石英衬底上的Cr（CO）_6的多光子解离引发Cr沉积。在透明（熔融石英）和吸收（铬金属）基板上沉积的机制进行了讨论。最后，我们描述了实验，进行了扩展的光掩模修复过程中，以更短的波长（低于200 nm），使用由频率混合的超短，30-fs脉冲在Ar填充的毛细管中产生的光。
The use of ultrafast laser pulses is having an impact on materials processing in profound ways. “Machining” with femtosecond pulses affords considerable advantages over nanosecond pulses, such as subdiffraction-limited material ablation, where ablated spot dimensions are below that achievable when longer pulses are focused to the minimum spot size dictated by optical physics. These properties have been exploited to address what had become a critical problem in the semiconductor industry, the repair of patterned photomasks. We will describe how the fundamentals of femtosecond laser ablation have been implemented in a machine designed to repair photomasks. We will also describe experiments designed to deposit Cr metal onto fused-silica substrates using 100-fs, 400-nm light pulses at atmospheric pressure. Multiphoton dissociation of Cr(CO)_6 adsorbed on fused-silica substrates initiates Cr deposition. The mechanisms for deposition on both transparent (fused silica) and absorbing (Cr metal) substrates are discussed. Finally, we describe experiments that were carried out to extend the photomask repair process to shorter wavelengths (below 200 nm) using light generated by frequency-mixing of ultrashort, 30-fs pulses in an Ar-filled capillary.