High-power impulse magnetron sputtering and its applications

High-power impulse magnetron sputtering and its applications
复制标题

DOI:
10.1351/pac-con-09-10-43
复制
发表时间:
2009-06
影响因子:
1.8
通讯作者:
A. Ehiasarian
A. Ehiasarian
中科院分区:
化学4区
文献类型:
--
作者:
A. Ehiasarian

文献摘要

被引文献

相似文献

高功率脉冲磁控溅射(HIPIMS)是在20世纪90年代末引入的一种独特的物理气相沉积方法。该技术利用磁控溅射阴极和高峰功率密度高达3千瓦cm-2的目标。等离子体产生具有高电离度的金属通量。HIPIMS已成功地用作衬底预处理方法,以通过促进局部外延生长来增强涂层附着力。作为一种沉积技术,HIPIMS可以制备高密度的微结构薄膜。它已被工业化,并已成功地应用于硬,电子和光学涂层。
High-power impulse magnetron sputtering (HIPIMS) was introduced in the late 1990s as a unique physical vapor deposition method. The technology utilizes magnetron sputtering cathodes and high peak power density of up to 3 kW cm–2 on the target. The plasma produces a metal flux with high degree of ionization. HIPIMS has been successfully used as a substrate pretreatment method to enhance coating adhesion by promoting local epitaxial growth. As a deposition technology, HIPIMS produces high-density microstructure films. It has been industrialized and has successful applications in hard, electronic, and optical coatings.