Applying NiTi Shape-Memory Thin Films to Thermomechanical Data Storage Technology
Applying NiTi Shape-Memory Thin Films to Thermomechanical Data Storage Technology
复制标题
将镍钛形状记忆薄膜应用于热机械数据存储技术
DOI：
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发表时间：
2004
期刊：
影响因子：
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通讯作者：
G. Shaw
中科院分区：
文献类型：
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作者：
W. Crone;G. Shaw
随着尖端微电子器件中的数据存储密度持续增加，超顺磁效应对磁性数据存储介质提出了问题。克服这一障碍的一个策略是使用热机械数据存储技术。在这种方法中，数据由纳米级机械探针作为表面上的压痕写入，由内置于探针中的传感器读取，然后通过加热擦除。这种设备的一个例子是IBM millipede，它使用聚合物薄膜作为数据存储介质。然而，也可以使用其他种类的介质用于热机械数据存储，并且在下面的工作中，我们探索使用薄膜Ni-Ti形状记忆合金（SMA）的可能性。先前的工作已经表明，在马氏体相Ni-Ti SMA薄膜中制造的纳米级压痕在加热时基本上恢复。诸如压痕的重复热机械循环、压痕接近度和膜厚度等问题影响该技术的实用性。虽然仍有一些问题需要解决，但实验证据和理论预测表明SMA薄膜是一种合适的热机械数据存储介质。
As the data storage density in cutting edge microelectronic devices continues to increase, the superparamagnetic effect poses a problem for magnetic data storage media. One strategy for overcoming this obstacle is the use of thermomechanical data storage technology. In this approach, data is written by a nanoscale mechanical probe as an indentation on a surface, read by a transducer built into the probe, and then erased by the application of heat. An example of such a device is the IBM millipede, which uses a polymer thin film as the data storage medium. It is also possible, however, to use other kinds of media for thermomechanical data storage, and in the following work, we explore the possibility of using thin film Ni-Ti shape memory alloy (SMA). Previous work has shown that nanometer-scale indentations made in martensite phase Ni-Ti SMA thin films recover substantially upon heating. Issues such as repeated thermomechanical cycling of indentations, indent proximity, and film thickness impact the practicability of this technique. While there are still problems to be solved, the experimental evidence and theoretical predictions show SMA thin films are an appropriate medium for thermomechanical data storage.