Influence of electric current pulses on the solidification of Cu-Bi-Sn immiscible alloys.
Influence of electric current pulses on the solidification of Cu-Bi-Sn immiscible alloys.
复制标题
电流脉冲对Cu-Bi-Sn难混溶合金凝固的影响
DOI：
10.1038/srep12680
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发表时间：
2015-07-31
影响因子：
4.6
通讯作者：
Jiuzhou Z
中科院分区：
文献类型：
--
作者：
Hongxiang J;Jie H;Jiuzhou Z
对Cu-Bi-Sn合金进行了脉冲电流作用下的连续凝固实验。建立了描述微观组织演化的模型。计算了连续凝固合金中微观组织的形成。计算结果表明，电磁脉冲主要通过改变少数相液滴形核的能垒来影响凝固过程。当基质液体具有与MPD相比更低的电导率时，ECP导致MPD成核的能垒降低，从而促进细分散的微结构的形成。当基质液体具有比MPD更高的电导率时，ECP导致成核的能垒增加，并导致形成相分离的微观结构。
Continuous solidification experiments were carried out with Cu-Bi-Sn alloys under the effects of Electric Current Pulses (ECPs). A model describing the microstructure evolution was developed. The formation of the microstructure in the continuously solidified alloys was calculated. The calculations demonstrated that ECPs mainly affect the solidification process through changing the energy barrier for the nucleation of the minority phase droplets (MPDs). When the matrix liquid has a lower electric conductivity compared to the MPD, the ECPs lead to a decrease in the energy barrier for the nucleation of the MPDs which then promote the formation of a finely dispersed microstructure. When the matrix liquid has a higher electric conductivity compared to the MPD, the ECPs cause an increase in the energy barrier for the nucleation and lead to the formation of a phase segregated microstructure.