Multidimensional device architectures for efficient power electronics
Multidimensional device architectures for efficient power electronics
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DOI：
10.1038/s41928-022-00860-5
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发表时间：
2022-11
影响因子：
34.3
通讯作者：
Yuhao Zhang;F. Udrea;Han Wang
中科院分区：
文献类型：
--
作者：
Yuhao Zhang;F. Udrea;Han Wang
功率半导体器件是在电力电子系统中实现高效能量转换的关键，这对于减少能源损失、减少二氧化碳排放和创造更可持续的技术至关重要。尽管需要使用宽带隙或超宽带隙材料来开发改进的功率器件，但无论底层材料技术如何，多维架构也可以提高性能。特别是，多维器件架构，如超结，多通道和多门技术，可以使电力电子系统的速度，效率和形状因子的进步。在这里，我们回顾了高效电力电子多维器件架构的发展。我们探讨了使用多维架构和不同架构的基本原理。我们还考虑了架构的性能限制、可扩展性和材料特性，并确定了实现该方法全部潜力所需解决的关键技术挑战。
Power semiconductor devices are key to delivering high-efficiency energy conversion in power electronics systems, which is critical in efforts to reduce energy loss, cut carbon dioxide emissions and create more sustainable technology. Although the use of wide or ultrawide-bandgap materials will be required to develop improved power devices, multidimensional architectures can also improve performance, regardless of the underlying material technology. In particular, multidimensional device architectures—such as superjunction, multi-channel and multi-gate technologies—can enable advances in the speed, efficiency and form factor of power electronics systems. Here we review the development of multidimensional device architectures for efficient power electronics. We explore the rationale for using multidimensional architectures and the different architectures available. We also consider the performance limits, scaling and material figure of merits of the architectures, and identify key technological challenges that need to be addressed to realize the full potential of the approach.