Magnetic properties of nanocrystalline CoPt electrodeposited films. Influence of P incorporation
Magnetic properties of nanocrystalline CoPt electrodeposited films. Influence of P incorporation
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DOI：
10.1007/s10008-010-1055-3
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发表时间：
2010-04
影响因子：
2.5
通讯作者：
M. Cortés;E. Gómez;E. Vallés
中科院分区：
文献类型：
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作者：
M. Cortés;E. Gómez;E. Vallés
电沉积富铂CoPt薄膜的目的是在硅基衬底上制备硬磁薄膜，而不需要随后的退火。电沉积条件允许控制薄膜的晶体结构。在保持六方Co相的情况下，Pt含量可达60-65 wt.%，从而使CoPt薄膜具有中等矫顽力和良好的耐腐蚀性。然而，当使用低沉积电位时，可以得到较高Pt百分比的CoPt薄膜，但在这种情况下，薄膜呈现fcc结构，具有较低的矫顽力和较差的耐腐蚀性。溶液中亚磷酸盐的存在限制了沉积CoPtP薄膜中铂的百分比，但在这种情况下总是观察到六方密排（hcp）结构。与纯CoPt相比，P的加入使膜的矫顽力和涂层的耐腐蚀性都有所提高。Pt含量为40%的高cp CoPtP镀层矫顽力最高。
Platinum-rich CoPt films have been electrodeposited with the aim of preparing hard magnetic films on silicon-based substrates without the need for subsequent annealing. Electrodeposition conditions have permitted the crystalline structure of the films to be controlled. Pt percentages of up to 60–65 wt.% have been attained while maintaining the hexagonal Co phase, leading to CoPt films with moderate coercivity and good corrosion resistance. However, when low deposition potentials were used, CoPt films with higher Pt percentages were obtained, but in this case, the films exhibited an fcc structure, having lower coercivity and less corrosion resistance. The presence of hypophosphite in the solution limited the platinum percentage in the deposited CoPtP films, but an hexagonal close-packed (hcp) structure was always observed in this case. The incorporation of P into the deposits led to increases in both the coercivity of the films and the corrosion resistance of the coatings, with respect to pure CoPt. The highest coercivity was obtained for hcp CoPtP deposits with 40 wt.% of Pt.