Characterization of 1st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications
Characterization of 1st Generation High-Strain Elastomer MEMS Sensors for Morphing Aircraft Applications
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用于变形飞机应用的第一代高应变弹性体 MEMS 传感器的表征
DOI：
10.1115/ipack2007-33871
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
A. Huang
中科院分区：
文献类型：
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作者：
Arun Madyala;A. Huang
我们开发了第一个基于最近开发的制造技术的MEMS高应变传感器，即直接聚合物衬底图案技术（DPPOST）。DPPOST允许光刻定义的弹性体结构以类似于蒸发金属的提升过程的方式直接在基板上图案化。硅树脂弹性体（RTV-11或RTV-615）由于其机械性能和广泛可用性而被用作传感器元件的基体材料。炭黑纳米颗粒用于提供10阶的传感元件电阻率Ω-cm。本文将讨论第一代MEMS高应变传感器的设计、制造和开发；用于低速风洞中高弹性机翼的实验测量。ASME版权所有©2007
We have developed the first MEMS high-strain sensor based on the recently developed fabrication technology, the Direct Polymer Patterning On Substrate Technique (DPPOST). DPPOST allows lithographically defined elastomer structures to be directly patterned on a substrate in a similar fashion like the lift-off process of evaporated metals. Silicone elastomers (RTV-11 or RTV-615) are used as the matrix materials for the sensor element due to its mechanical properties and widespread availability. Carbon black nano-particles are used to provide the sensing element electrical resistivity on the order 10 Ω-cm. This paper will discuss the design, fabrication, and development of the 1st generation MEMS high strain sensor; for experimental measurements on a highly elastic wing in a low-speed wind-tunnel.Copyright © 2007 by ASME