Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading
Fatigue-strength prediction of microelectronics solder joints under thermal cyclic loading
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热循环载荷下微电子焊点的疲劳强度预测
DOI：
10.1109/itherm.1996.534556
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发表时间：
1996
期刊：
影响因子：
--
通讯作者：
Qiang Yu
中科院分区：
文献类型：
--
作者：
M. Shiratori;Qiang Yu
对薄单轮廓封装（TSOP）、球栅阵列（BGA）和无导线陶瓷芯片载体（LCCC）焊点进行了应力应变分析，研究了温度循环或等温循环加载下焊点的塑性蠕变行为和应力松弛行为。所有数值分析都考虑了塑性行为（屈服应力）和蠕变行为（蠕变特性）的温度依赖性。有限元分析（FEA）结果表明，在加速温度循环试验中，较长的高温和低温停留时间对提高焊点的循环非弹性等效应变范围没有贡献，但在工作状态下，停留时间期间发生的蠕变行为是估计焊点疲劳寿命的重要考虑因素。在应变分析结果的基础上，提出了微电子焊点温度循环和等温疲劳试验的有效方法，并进行了循环试验。实验结果与分析结果吻合较好。
The stress-strain analyses for the solder joints in a thin single outline package (TSOP), a ball grid array (BGA) assembly, and a leadless ceramic chip carrier (LCCC) are carried out to investigate the plastic-creep behavior, and stress relaxation behavior due to the temperature cycling or isothermal cyclic loading. The temperature dependence of plastic behavior (yield stress) and creep behavior (creep properties) are taken into consideration in all numerical analyses. The results of finite element analysis (FEA) show that in an accelerated temperature cycling test, long high-temperature and low-temperature dwell times do not contribute to increase the cyclic inelastic equivalent strain range in solder joints, although the creep behavior occurring during the dwell times in an operating condition is very important to be taken into consideration for estimating the fatigue life of solder joints. Based upon the results of the strain analyses, some efficient testing processes of temperature cycling and isothermal fatigue tests for the microelectronic solder joints are proposed, and the cycling tests are carried out. The experimental results show a good agreement with the analytic results.