Surface modification of polyimide film surface by silane coupling reactions for copper metallization
Surface modification of polyimide film surface by silane coupling reactions for copper metallization
复制标题
通过硅烷偶联反应对聚酰亚胺薄膜表面进行表面改性以实现铜金属化
DOI：
10.1163/15685610152540821
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发表时间：
2001
影响因子：
2.3
通讯作者：
T. Baba
中科院分区：
文献类型：
--
作者：
N. Inagaki;S. Tasaka;T. Baba
为了提高金属铜与Kapton薄膜的结合力，采用氩等离子体处理和偶联反应相结合的方法在Kapton薄膜表面引入氰基和氨基。3-氨丙基三甲氧基硅烷（APS-1）、3-氨丙基三乙氧基硅烷（APS-2）、2-氰乙基三乙氧基硅烷（CES）和3-氰丙基三乙氧基硅烷（CPS）用于偶联反应。从金属铜/Kapton系统的剥离强度评估氰基和氨基对与金属铜的粘附的影响。氰基有助于与铜金属的粘附，但氨基没有贡献。铜金属/CES-和CPS-改性的Kapton系统中的剥离强度分别为2.2和2.3 N/5 mm，比未改性的Kapton膜的值（0.94 N/5 mm）高2.3-2.4倍。故障的轨迹被发现是在一个弱边界层（WBL）中的铜金属/CPS改性Kapton系统; WBL可以来自Ar等离子体处理Kapton或原始Kapton层。
To improve the adhesion between copper metal and Kapton film, cyano and amino groups were introduced onto Kapton film surfaces by a combination of argon plasma treatment and coupling reactions. 3-Aminopropyltrimethoxysilane (APS-1), 3-aminopropyltriethoxysilane (APS-2), 2-cyanoethyltriethoxysilane (CES), and 3-cyanopropyltriethoxysilane (CPS) were used for the coupling reactions. The effects of the cyano and amino groups on the adhesion with copper metal were assessed from the peel strength of copper metal/Kapton systems. Cyano groups contributed to the adhesion with copper metal, but amino groups did not contribute. The peel strengths in the copper metal/CES- and CPS-modified Kapton systems were 2.2 and 2.3 N/5 mm, respectively, 2.3-2.4 times higher than the value for the unmodified Kapton film (0.94 N/5 mm). The locus of failure was found to be in a weak boundary layer (WBL) in the copper metal/CPS-modified Kapton system; the WBL could originate from the Ar plasma-treated Kapton or the original Kapton layer.