Direct-write assembly of three-dimensional photonic crystals:: Conversion of polymer scaffolds to silicon hollow-woodpile structures
Direct-write assembly of three-dimensional photonic crystals:: Conversion of polymer scaffolds to silicon hollow-woodpile structures
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DOI：
10.1002/adma.200501447
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发表时间：
2006-02-17
影响因子：
29.4
通讯作者：
Braun, PV
中科院分区：
文献类型：
--
作者：
Gratson, GM;García-Santamaría, F;Braun, PV
3D Si hollow-woodpile photonic crystals are formed through the direct-write assembly of concentrated polyelectrolyte inks (rods similar to 1 mu m in diameter) followed by a sequential silica/silicon chemical vapor deposition process (see Figure). The direct conversion of 3D polymer microstructures to materials like silicon may enable such applications as photonic materials, low-cost microelectromechanical systems (MEMS), microfluidic networks for heat dissipation, and biological devices.
