The Produced Cu+ Ionic Concentration Distribution Simulation inside the Via with PR Pulse Current Waveform
The Produced Cu+ Ionic Concentration Distribution Simulation inside the Via with PR Pulse Current Waveform
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DOI：
10.1149/2.0401412jes
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发表时间：
2014
影响因子：
3.9
通讯作者：
Taro Hayashi;M. Yokoi;N. Okamoto;Takeyasu Saito;K. Kondo
中科院分区：
文献类型：
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作者：
Taro Hayashi;M. Yokoi;N. Okamoto;Takeyasu Saito;K. Kondo
我们已经发表了一份报告，表明通过使用旋转环盘电极（RRDE），环电流，即Cu+离子浓度随着周期性反向脉冲电流波形的反向电流的增加而增加。此外，我们已经表明，空隙减少与反向电流的增加。然而，实际通孔内的Cu+离子浓度是未知的。在这项研究中，一个计算的一维扩散模型已被采用。基于通孔内的Cu+离子浓度，如果与电沉积期间的Cu+离子浓度相比，则溶解期间的Cu+离子浓度高两个数量级。通孔内的Cu+离子浓度随着周期性反向脉冲电流波形的反向电流的增加而增加。该计算结果对应于已发布的RRDE结果。此外，在周期性反向脉冲电流波形的截止时间期间，通孔底部的Cu+离子浓度增加。Cu+离子增加了PEG、SPS和Cl−三种添加剂的过掩模的沟槽底电极的电流。通过采用反向电流实现了通孔底部Cu+浓度的增加。
We already have published a report indicating that the ring current, ie, the Cu+ ion concentration increases with the increase in the reverse current of a periodic reverse pulse current waveform by using a rotating ring disk electrode (RRDE). Furthermore, we have shown that the void decreases with an increase in the reverse current. However, the Cu+ ion concentration within the actual via is unknown. A one calculated dimensional diffusion model has been adapted in this study. Based on the Cu+ ion concentration within the via, the Cu+ ion concentration during dissolution is two orders higher if compared for that during the electrodeposition. The Cu+ ion concentration within the via increases with the increasing reverse current of a periodic reverse pulse current waveform. This calculated result corresponds for the published RRDE result. Furthermore, the Cu+ ion concentration at the via bottom increases during the off-time of a periodic reverse pulse current waveform. The Cu+ ion increases the current of the trench bottom electrode of through mask with three additives of PEG, SPS and Cl−. An increase in the Cu+ concentration at the via bottom is achieved by adopting the reverse current.