Vertical chip-to-chip coupling between silicon photonic integrated circuits using cantilever couplers.
Vertical chip-to-chip coupling between silicon photonic integrated circuits using cantilever couplers.
复制标题
使用悬臂耦合器的硅光子集成电路之间的垂直芯片到芯片耦合。
DOI：
10.1364/oe.19.004722
复制
发表时间：
2011
期刊：
影响因子：
3.8
通讯作者：
R. Reano
中科院分区：
文献类型：
--
作者：
P. Sun;R. Reano
我们演示了使用硅带波导悬臂耦合器的垂直芯片到芯片光耦合。导波耦合器由嵌入二氧化硅悬臂内的硅带波导组成。悬臂通过残余应力在平面外偏转 90°，从而允许单独芯片之间的垂直光耦合。在 1550 nm 波长处，测量 TE 偏振的芯片间耦合损耗为每个连接 2.5 dB，TM 偏振的芯片间耦合损耗为 1.1 dB。两种偏振的耦合损耗在 1500 nm 至 1565 nm 波长范围内变化小于±0.8 dB。该耦合器可实现宽带和紧凑的系统架构，涉及光子集成电路之间的高速垂直数据传输。
We demonstrate vertical chip-to-chip light coupling using silicon strip waveguide cantilever couplers. The guided-wave couplers consist of silicon strip waveguides embedded within silicon dioxide cantilevers. The cantilevers deflect 90° out-of-plane via residual stress, allowing vertical light coupling between separate chips. A chip-to-chip coupling loss of 2.5 dB per connection is measured for TE polarization and 1.1 dB for TM polarization at 1550 nm wavelength. The coupling loss varies by less than±0.8 dB within the wavelength range from 1500 nm to 1565 nm for both polarizations. The couplers enable broadband and compact system architectures involving high speed vertical data transport between photonic integrated circuits.