Photonic wire bonding: a novel concept for chip-scale interconnects
Photonic wire bonding: a novel concept for chip-scale interconnects
复制标题
DOI：
10.1364/oe.20.017667
复制
发表时间：
2012-07-30
期刊：
影响因子：
3.8
通讯作者：
Koos, C.
中科院分区：
文献类型：
--
作者：
Lindenmann, N.;Balthasar, G.;Koos, C.
光子集成需要一种通用的封装技术，使三维配置中的光子芯片之间的低损耗互连成为可能。在本文中，我们介绍了光子引线键合的概念，其中聚合物波导与三维自由形状的几何形状被用来桥接位于不同芯片上的纳米光子电路之间的差距。在一个原理验证实验中，我们展示了用直写双光子光刻技术制作单模光子引线键合（PWB）。第一代原型允许高效的宽带耦合，C波段的平均插入损耗仅为1.6 dB，并且可以以多Tbit/s的数据速率承载波分复用信号。光子引线键合非常适合自动化大规模生产，我们希望该技术能够使光学多芯片系统具有更高的性能和灵活性。(C)2012美国光学学会
Photonic integration requires a versatile packaging technology that enables low-loss interconnects between photonic chips in three-dimensional configurations. In this paper we introduce the concept of photonic wire bonding, where polymer waveguides with three-dimensional freeform geometries are used to bridge the gap between nanophotonic circuits located on different chips. In a proof-of-principle experiment, we demonstrate the fabrication of single-mode photonic wire bonds (PWB) by direct-write two-photon lithography. First-generation prototypes allow for efficient broadband coupling with average insertion losses of only 1.6 dB in the C-band and can carry wavelength-division multiplexing signals with multi-Tbit/s data rates. Photonic wire bonding is well suited for automated mass production, and we expect the technology to enable optical multi-chip systems with enhanced performance and flexibility. (C) 2012 Optical Society of America