Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear
Modeling of the stick-slip effect in heavy copper wire bonding to determine and reduce tool wear
复制标题
对粗铜线键合中的粘滑效应进行建模，以确定和减少工具磨损
DOI：
10.1109/eptc.2015.7412375
复制
发表时间：
2015
期刊：
影响因子：
--
通讯作者：
K. Guth
中科院分区：
文献类型：
--
作者：
A. Unger;W. Sextro;T. Meyer;Paul Eichwald;Simon Althoff;Florian Eacock;M. Brokelmann;M. Hunstig;K. Guth
为了提高铜线键合的质量和可靠性，自优化技术是一种很有前途的技术。为了实现超声重铜线粘接机的自优化，粘接过程中工具与线材之间以及线材与基体之间的粘滑运动模型是必不可少的。调查证实，这两种接触确实在每个周期振荡中表现出粘滑运动。首先，本文通过激光测量对粘滑效应进行了建模，并对粘滑效应进行了测量、监测和分析。第二步，采用迭代数值参数辨识方法，建立了一个参数化的动态模型。该模型包括Archard的磨损方法，以计算整个过程中由于磨损造成的工具尖端损失体积。通过比较测量和计算的刀尖和线材振幅对模型进行了验证，表明模型质量很高。然后，就可以计算不同工艺参数下刀具的寿命，即法向力和超声波电压的值。
To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tool tip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard's wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage.