An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments
An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments
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一种使用焊料凸块的光学芯片创新键合技术，无需芯片定位调整
DOI：
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发表时间：
1992
期刊：
影响因子：
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通讯作者：
T. Hayashi
中科院分区：
文献类型：
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作者：
T. Hayashi
该技术的有价值的特征是由于熔融焊料的表面张力而使光学芯片自对准。这消除了为了耦合目的而对芯片定位进行艰苦调整的需要。对准精度随着焊料凸块直径的减小和凸块数量的增加而增加。对于具有四个直径为75 μ m的凸块的试样，获得了1.0 μ m的平均未对准，而对于具有16个直径为130 μ m的凸块的试样，获得了0.8 μ m的平均未对准。对准精度的长期稳定性通过使试样经受热循环来测试。小于+或-0.5 μ m的对齐波动后发现1000小时（超过300个周期）。这些结果表明，焊料凸点是适合于这样的应用，如光电探测器的光电电路板的键合。>
The valuable feature of this technique is self-alignment of the optical chips due to the surface tension of the molten solder. This eliminates the need for painstaking adjustments of chips positioning for coupling purposes. The alignment accuracy increases as the solder bump diameter decreases and as the number of bumps increases. An average misalignment of 1.0 mu m was obtained for specimens with four bumps 75 mu m in diameter, whereas an average misalignment of 0.8 mu m was obtained for specimens with 16 bumps 130 mu m in diameter. The long-term stability of the alignment accuracy was tested by subjecting the specimens to thermal cycling. Alignment fluctuations of less than +or-0.5 mu m were found after 1000 h (over 300 cycles). These results suggest that the solder bumps are suitable for such applications as the bonding of photodetectors to optoelectronic circuit boards. >