Orientation dependence of electron and phonon thermal conduction and its correlation with mechanical strength in aluminum interfaces
Orientation dependence of electron and phonon thermal conduction and its correlation with mechanical strength in aluminum interfaces
复制标题
铝界面中电子和声子热传导的方向依赖性及其与机械强度的相关性
DOI：
10.1063/1.4815954
复制
发表时间：
2013
影响因子：
3.2
通讯作者：
V. Tomar
中科院分区：
文献类型：
--
作者：
V. Samvedi;V. Tomar
本工作对Al界面中电子和声子热传导的取向依赖性进行了研究。重点是在300 K到900 K的温度范围内量化界面取向的影响，拉伸应变的影响，以及温度对被检查的Al界面上电子和声子热传导的影响。Al是金属，自由电子是热载体的主要来源。分析表明，随着温度的升高，Al强度的降低伴随着声子和电子导热系数的变化。单晶铝的温度升高、强度降低、声子导热系数降低、电子导热系数增大之间存在着直接的相关性。受检界面热膨胀的各向异性和失配有助于降低伴生材料的软化温升，降低伴生电子热导和声子热导。
This work presents an understanding of orientation dependence of electronic and phononic thermal conduction in Al interfaces. Focus is on quantifying the effect of interface orientation, the effect of tensile strain, and the effect of temperature on electronic and phononic thermal conduction across examined Al interfaces at temperatures ranging from 300 K to 900 K. Al being metal has free electrons as the primary source of heat carriers. Analyses indicate that the Al strength reduction with increase in temperature occurs in combination with phonon and electron thermal conductivity change. Single crystalline Al shows a direct correlation among the temperature increase, strength reduction, phonon thermal conductivity decrease, and electron thermal conductivity increase. The anisotropy and mismatch in thermal expansion at examined interfaces contributes to reduction in temperature increase associated material softening and to reductions in associated electron thermal conductance and phonon thermal conductanc...
影响因子：
3.7
作者：
V. Vlček;N. Koker;G. Steinle‐Neumann
通讯作者：
V. Vlček;N. Koker;G. Steinle‐Neumann