Carbon-Nanotube-Enhanced Thermal Contactor in Low Contact Pressure Region

Carbon-Nanotube-Enhanced Thermal Contactor in Low Contact Pressure Region
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低接触压力区碳纳米管增强热接触器

DOI:
10.1143/jjap.49.070210
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发表时间:
2010
影响因子:
1.5
通讯作者:
Shuji Tanaka
Shuji Tanaka
中科院分区:
物理与天体物理4区
文献类型:
--
作者:
T. Tsukamoto;M. Esashi;Shuji Tanaka

文献摘要

被引文献

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我们首次展示了使用碳纳米管在微尺度上显著降低弯曲热接触器的接触热阻(TCR)。利用碳纳米管还原TCR以前的报道是接触表面平坦的,但实际微器件的热接触表面由于其残余应力和热应力而经常弯曲。我们对平面和弯曲接触面进行了评估,以将该方法应用于各种应用。TCR的还原不仅在平坦的接触面上观察到,而且在弯曲表面上也能观察到。采用等离子体增强化学气相沉积(PECVD)生长的10µm长“碳纳米管地毯”的弯曲式微型热接触器,在接触压力为20kPa时,其TCR约为600mm2 K/W,约为没有“碳纳米管地毯”的基准接触器的1/10。该技术对微热开关等微热器件具有一定的实用价值。
We first demonstrated considerable reduction of thermal contact resistance (TCR) of a bending thermal contactor in microscale using carbon nanotubes (CNTs). TCR reduction using CNTs were previously reported with flat contact surface, but the thermal contact surfaces of actual microdevices often bend because of their residual and thermal stress. We evaluated both flat and bending contact surfaces to apply this method for a variety of applications. The TCR reduction is observed not only with a flat contact surface but also a bending surface. A bending micro thermal contactor with a plasma-enhanced chemical vapor deposition (PECVD)-grown 10 µm long “CNT carpet” shows a TCR of ca. 600 mm2 K/W at a contact pressure of 20 kPa, which is about 1/10 to the TCR of the reference contactor without “CNT carpet”. This technique is useful for micro thermal devices such as micro thermal switch.