Fine grinding of silicon wafers: a mathematical model for the chuck shape
Fine grinding of silicon wafers: a mathematical model for the chuck shape
复制标题
DOI：
--
复制
发表时间：
2003
期刊：
影响因子：
--
通讯作者：
S. Chidambarama;Z. J. Peia;S. Kassirb
中科院分区：
文献类型：
--
作者：
S. Chidambarama;Z. J. Peia;S. Kassirb
硅晶圆精磨技术是一项经济有效地制造超平面半导体晶圆的专利技术。之前在该期刊上发表过两篇关于精细磨削的论文，一篇讨论了其独特性和特殊要求，另一篇介绍了设计实验研究的结果。作为后续，本文提出了一项研究，旨在克服阻碍该技术广泛应用的技术障碍之一，即卡盘制备的难度和不确定性。虽然卡盘形状在精细磨削中是至关重要的，但它的制备没有标准的程序。此外，关于设置参数和最终卡盘形状之间关系的信息并不容易获得。本文首先建立了卡盘形状的数学模型。然后利用该模型预测了卡盘形状与设置参数之间的关系。最后，讨论了验证模型的中试结果。2003 Elsevier Science Ltd.版权所有。
Fine grinding of silicon wafers is a patented technology to manufacture super flat semiconductor wafers cost-effectively. Two papers on fine grinding were previously published in this journal, one discussed its uniqueness and special requirements, and the other presented the results of a designed experimental investigation. As a follow up, this paper presents a study aiming at overcoming one of the technical barriers that have hindered the widespread application of this technology, namely, the difficulty and uncertainty in chuck preparation. Although the chuck shape is critically important in fine grinding, there are no standard procedures for its preparation. Furthermore, the information on the relation between the set-up parameters and the resulting chuck shape is not readily available. In this paper, a mathematical model for the chuck shape is first developed. Then the model is used to predict the relations between the chuck shape and the set-up parameters. Finally, the results of the pilot experiments to verify the model are discussed. 2003 Elsevier Science Ltd. All rights reserved.