Planar pixel detector module development for the HL-LHC ATLAS pixel system

Planar pixel detector module development for the HL-LHC ATLAS pixel system
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用于 HL-LHC ATLAS 像素系统的平面像素探测器模块开发

DOI:
10.1016/j.nima.2013.04.043
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发表时间:
2013
期刊:
Accelerators, Spectrometers, Detectors and Associated Equipment
影响因子:
--
通讯作者:
Bates R
Bates R
中科院分区:
--
文献类型:
--
作者:
Bates R

文献摘要

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摘要三维硅探测器是大型强子对撞机最内层跟踪装置中最有前途的技术之一。在FBK(特伦托,意大利)制造的与CMS读出兼容的3D传感器在实验室中进行了测试,并在FNAL测试束设施中使用120 GeV/c质子束,在辐照之前和之后达到3.5× 10 15 neq/cm 2的通量。给出了数据分析的初步结果。
Abstract Three-dimensional (3D) silicon detectors are emerging as one of the most promising technologies for the innermost layers of tracking devices for the foreseen upgrades of the LHC. 3D sensors compatible with the CMS readout, fabricated at FBK (Trento, Italy), were tested in the laboratory and with a 120 GeV/c proton beam at the FNAL test beam facility, before and after irradiation up to a fluence of 3.5× 10 15 neq/cm 2. Preliminary results of the data analysis are presented.