Effect of surface tension and coefficient of thermal expansion in 30 nm scale nanoimprinting with two flexible polymer molds
Effect of surface tension and coefficient of thermal expansion in 30 nm scale nanoimprinting with two flexible polymer molds
复制标题
使用两个柔性聚合物模具进行 30 nm 级纳米压印时表面张力和热膨胀系数的影响
DOI:
10.1088/0957-4484/23/23/235303
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发表时间:
2012
期刊:
影响因子:
3.5
通讯作者:
K. Suh
中科院分区:
文献类型:
--
作者:
Jae kwan Kim;H. Cho;Ho;Kipil Lim;Ki;D. Choi;Jun‐ho Jeong;K. Suh
We report on nanoimprinting of polymer thin films at 30 nm scale resolution using two types of ultraviolet (UV)-curable, flexible polymer molds: perfluoropolyether (PFPE) and polyurethane acrylate (PUA). It was found that the quality of nanopatterning at the 30 nm scale is largely determined by the combined effects of surface tension and the coefficient of thermal expansion of the polymer mold. In particular, the polar component of surface tension may play a critical role in clean release of the mold, as evidenced by much reduced delamination or broken structures for the less polarized PFPE mold when patterning a relatively hydrophilic PMMA film. In contrast, such problems were not notably observed with a relatively hydrophobic PS film for both polymer molds. In addition, the demolding characteristic was also influenced by the coefficient of thermal expansion so that no delamination or uniformity problems were observed when patterning a UV-curable polymer film at room temperature. These results suggest that a proper polymeric mold material needs to be chosen for patterning polymer films under different surface properties and processing conditions, providing insights into how a clean demolding characteristic can be obtained at 30 nm scale nanopatterning.