Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder
Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder
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DOI：
10.1016/j.msea.2010.02.048
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发表时间：
2010-06
期刊：
影响因子：
6.4
通讯作者：
F. Tai;F. Guo;M. Han;Z. Xia;Y. Lei;Y. Shi
中科院分区：
文献类型：
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作者：
F. Tai;F. Guo;M. Han;Z. Xia;Y. Lei;Y. Shi
采用原位合成法制备了以Sn-3. 5Ag共晶钎料为基体，以Cu 6Sn 5金属间化合物（IMC）为增强相的复合钎料。在Sn-3.5Ag共晶钎料中加入Cu和Sn金属颗粒，在钎料基体中形成Cu 6Sn 5增强体。轧制后，Cu 6Sn 5IMC被粉碎成细小颗粒，并均匀分布在复合焊料中。研究了Sn-3.5Ag共晶钎料及其原位Cu 6Sn 5增强复合钎料接头的蠕变和热机械疲劳性能。结果表明，与Sn-3.5Ag共晶钎料相比，原位Cu 6Sn 5钎料增强复合钎料焊点具有更好的稳态蠕变应变速率、更小的蠕变损伤和更高的残余剪切强度。结果表明，原位Cu 6Sn 5增强复合钎料具有良好的抗蠕变性能和抗蠕变性能。分析了原位Cu 6Sn 5增强复合焊点的断裂模式及原位Cu 6Sn 5增强颗粒的作用。
In this research, a composite solder, which consisted of the Sn–3.5Ag eutectic solder matrix and Cu6Sn5intermetallic compounds (IMCs) as reinforcements, was prepared by in situ method. Cu and Sn metallic particles were added into the molten Sn–3.5Ag eutectic solder to form Cu6Sn5reinforcements in solder matrix. After rolling, the Cu6Sn5IMCs are crushed into fine particles and distributed uniformly in the composite solder. The creep and thermomechanical fatigue (TMF) properties of the Sn–3.5Ag eutectic solder and its in situ Cu6Sn5reinforced composite solder joints were successively investigated. The experimental results showed that the in situ Cu6Sn5reinforced composite solder joint exhibited better steady-state creep strain rate, lesser TMF damages and higher residual shear strengths after different number of TMF cycles as compared to the Sn–3.5Ag eutectic solder joint. These indicated that the in situ Cu6Sn5reinforced composite solder possessed excellent creep resistance and TMF properties. Besides, the fracture mode of the in situ Cu6Sn5reinforced composite solder joint and the role of the in situ Cu6Sn5reinforcing particles were analyzed.