Heat Transfer Performance of an Energy-saving Heat Removal Device with Uni-directional Porous Copper for Divertor Cooling

Heat Transfer Performance of an Energy-saving Heat Removal Device with Uni-directional Porous Copper for Divertor Cooling
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偏滤器冷却用单向多孔铜节能排热装置的传热性能

DOI:
10.1016/j.fusengdes.2018.03.010
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发表时间:
2018
影响因子:
1.7
通讯作者:
T. Tanaka
T. Tanaka
中科院分区:
工程技术3区
文献类型:
--
作者:
K. Takai;K. Yuki;R. Kibushi;N. Unno;T. Tanaka

文献摘要

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评估了偏滤器冷却装置EVAPORON-4的传热性能,该装置是为了在低泵功率条件下去除10 MW/m2的高热流而开发的。EVAPORON-4中使用的单向多孔介质由于其高有效导热性而使得在多孔介质的微通道中促进蒸发传热成为可能。在本研究中,我们评估将单向多孔介质焊接于沟槽式热传表面上对沸腾与蒸发热传性能的影响。传热实验表明,多孔介质焊接在沟槽表面上,由于促进了单向多孔介质中的蒸发,使得沸腾传热性能得到了显著提高,临界热流密度也进一步提高。特别地,在1.0 L/min和70 K的液体过冷度下实现了9.1 MW/m2的高热通量,这不是临界热通量。抽运功率特性也验证了单向多孔介质中的蒸发促进作用,并澄清了包括多孔结构在内的EVAPORON-4的问题。
Heat transfer performance of divertor cooling device EVAPORON-4, which was developed in order to remove a high heat flux of 10 MW/m2under low pumping power conditions, is evaluated. Uni-directional porous media used in EVAPORON-4 make it possible to promote evaporative heat transfer in microchannels of the porous medium due to its high effective thermal conductivity. In this study, we evaluate effect of soldering the uni-directional porous medium onto a grooved heat transfer surface on boiling and evaporative heat transfer performance. The heat transfer experiments prove that the boiling heat transfer performance is highly enhanced by soldering the porous medium onto the grooved surface due to the promotion of evaporation in the uni-directional porous medium and that the critical heat flux is also further increased. In particular, a high heat flux of 9.1 MW/m2, which is not critical heat flux, is achieved at 1.0 L/min and the liquid subcooling of 70 K. The pumping power characteristics also verify the evaporation promotion in the uni-directional porous medium and clarify the issues of EVAPORON-4 including the porous structure.