Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.
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DOI：
10.3390/s151229885
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发表时间：
2015-12-16
期刊：
影响因子：
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通讯作者：
Akita I
中科院分区：
文献类型：
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作者：
Okabe K;Jeewan HP;Yamagiwa S;Kawano T;Ishida M;Akita I
本文提出了一种用于小型脑表面植入系统的柔性天线和CMOS整流芯片的协同设计方法和晶圆级封装技术。所提出的协同设计方法优化了系统架构，避免了外部匹配元件的使用，从而实现了系统的小尺寸化。此外，在极薄的聚对二甲苯薄膜（5 μm）上组装硅大规模集成电路（LSI）芯片的技术可以将整流电路和柔性天线（整流天线）集成在一起。在无线电力传输（WPT）演示中，制作的柔性整流天线在天线间距为3 cm时的最大效率为0.497%。此外，无线电波的WPT允许与天线尺寸偏差185%，这意味着与电磁感应相比，偏差对WPT特性的影响较小。
In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.