Reliability of Planar SKiN Interconnect Technology
Reliability of Planar SKiN Interconnect Technology
复制标题
平面 SKiN 互连技术的可靠性
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
U. Scheuermann
中科院分区：
文献类型：
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作者：
U. Scheuermann
传统的模块设计在使用寿命上受到焊接界面和引线键合技术的限制。消除了传统的基板，并通过高可靠性的Ag烧结技术取代了焊料接口，从而实现了第一个100%无焊料模块。SKiN技术消除了显著提高使用寿命和可靠性的最后一个障碍：引线键合。它还通过Ag烧结互连替代了与散热器的接口，从而实现了非常紧凑和轻便的电力电子系统设计。
The classical module design is limited in lifetime by solder interfaces and wire bond technology. The elimination of the traditional base plate and the replacement of solder interfaces by a high reliable Ag sinter technology led to the first 100% solder free module. The SKiN technology eliminates the last obstacle to a significant lifetime and reliability improvement: the wire bonds. It additionally replaces the interface to the heat sink by an Ag sinter interconnect and thus allows a very compact and light design of power electronic systems.