Effect of Molecular Weight of Pressure-sensitive Adhesive to Peeling Phenomenon between Adhesive and Silicon Wafer by Molecular Dynamics Simulations
Effect of Molecular Weight of Pressure-sensitive Adhesive to Peeling Phenomenon between Adhesive and Silicon Wafer by Molecular Dynamics Simulations
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DOI：
10.2472/jsms.71.143
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发表时间：
2022-02
期刊：
影响因子：
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通讯作者：
Yuichi Iwakata;S. Izumi
中科院分区：
文献类型：
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作者：
Yuichi Iwakata;S. Izumi
我们利用分子动力学方法研究了压敏胶与硅片之间的剥离行为。我们的目的是阐明粘合剂分子量对剥离行为的影响。我们对不同分子量的粘合剂和不同表面粗糙度的硅基板（以无定形 SiO 2 为模型）进行了剥离模拟。我们重点关注应力-位移曲线、剥离应力的最大值以及剥离所需的能量。研究发现，分子量越大，表面粗糙度越大，剥离能越大。剥离能量取决于界面结合状态。相反，剥离应力的最大值与分子量部分相关。通过对剥离过程的详细观察，发现剥离应力取决于粘合剂分子链的网络。剥离应力的最大值随着约束到基底的部分分子链的数量以及通过交联连接到约束分子链的部分分子链的数量而增加。此外，连接的部分分子链的界面数量增加了最大剥离应力。我们的结果为粘合剂的设计提供了新的见解。
We have investigated the peeling behavior between pressure-sensitive adhesive and silicon wafer by using molecular dynamics method. Our aim is to clarify the effect of the molecular weight of adhesives to the peeling behavior. We have conducted peeling simulations with various molecular weight of adhesives and various surface roughness of silicon substrate as modeled by amorphous SiO 2 . We focus on the stress-displacement curve, the maximum value of peeling stress and the energy required for the peeling. It was found that the larger molecular weight and larger surface roughness induced larger peeling energy. Peeling energy is dependent on the interface bonding status. On the contrast, maximum value of peeling stress partially correlates with the molecular weight. From the detailed observation of peeling process, it was found that peeling stress is dependent on the network of adhesive molecule chains. The maximum value of the peel stress increases as the number of partial molecular chains constrained to the substrate, and the number of the partial molecular chains connected to the constrained molecular chain via increase of cross-links. In addition, the number of interfaces of the connected partial molecular chain increases the maximum peeling stress. Our results provide a new insight to the design of adhesive.