Friction welding of oxygen free copper to pure aluminium

Friction welding of oxygen free copper to pure aluminium
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DOI:
10.1080/09507119209548302
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发表时间:
1992
影响因子:
--
通讯作者:
M. Aritoshi;K. Okita;T. Enjo;K. Ikeuchi;F. Matsuda
M. Aritoshi;K. Okita;T. Enjo;K. Ikeuchi;F. Matsuda
中科院分区:
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文献类型:
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作者:
M. Aritoshi;K. Okita;T. Enjo;K. Ikeuchi;F. Matsuda

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铜钨烧结合金(以下简称Cu-W)具有导电性、抗氧化性等优良特性,但由于其价格昂贵,当将其应用于提供电接触的元件时,需通过银钎焊与异种金属(例如铜)进行附着。然而,出现的问题是,银钎焊接头的强度不仅低于铜基材的强度,而且变化很大。因此,需要开发一种Cu-W焊接方法,与银钎焊方法相比,可以获得更高的强度和更稳定的质量。为了检验摩擦焊应用于铜-钨与异种金属焊接的可行性,作者阐明了铜-钨中的钨含量对铜-钨与铜的摩擦焊接头强度的影响。 15 然而,对于未来可能使用的异种金属之一的铝,从迄今为止发表的研究结果中,很难估计形成何种类型的金属间化合物层等冶金显微组织以及它们对 Cu-W 摩擦焊缝强度的影响。关于 Cu(即 Cu-W 基体)与 Al 之间的摩擦焊,福岛县、10 Morozumi 等已有报道,其中指出由于金属间化合物的形成,接头强度可能会有所降低。然而,由于金属间化合物层非常薄,研究并没有太多地探讨其分布和形貌对接头强度的影响。因此,在本报告中,作为未来研究中Cu-W与Al摩擦焊现象检验的基础,在Al与无氧铜(以下简称OFC)(即类似于Cu基体金属的材料)之间进行了12次摩擦焊。目的首先是研究摩擦焊过程中形成的金属间化合物层的分布和形式,其次是研究确保良好接头强度的金属间化合物层的临界厚度,以及对接头强度影响最大的金属间化合物相。
Copper-tungsten sintered alloys (abbreviated as Cu-W below) have excellent characteristics such as electrical conductivity and oxidation resistance, but because of their high price, when they are applied to components to provide electrical contacts, they are attached by silver brazing with dissimilar metals (for example, copper). However, a problem arises in that the strength of the silver brazed joints is not only lower than that of the copper base material, but is also highly variable. For this reason, the development of a welding method for Cu-W is desired which would make it possible to obtain a higher strength and more stable quality as compared with the silver brazing method. To examine the feasibility of the application of friction welding to welding Cu-W and dissimilar metals, the authors clarified the effect of W content in Cu-W on friction welded joint strength in Cu-W to copper. 15 However, with respect to aluminium, one of the dissimilar metals likely to be employed in future, it is difficult from the research findings published so far" to estimate what kinds of metallurgical microstructures such as intermetallic compound layers are formed and what sort of effect they have on the strength of friction welds to Cu-W. Concerning friction welding between Cu, ie matrix of Cu-W, and Al, there have been reports by Fukushima, 10 Morozumi," etc, which pointed out the possibility of some reduction in joint strength owing to the formation of intermetallic compounds. However, since the intermetallic compound layers are very thin, the studies did not deal much with the effect of their distribution and morphology on the joint strength.Therefore, in this report, as a basis for the examination of phenomena in friction welding Cu-W to Al in future research, 12 friction welding was conducted between Al and oxygen free copper (abbreviated as OFC below), ie a material similar to Cu matrix metals. Objectives were first to study the distribution and form of the intermetallic layers formed during friction welding, and secondly to investigate the critical thickness of intermetallic layers for securing good joint strength, and also the intermetallic phases which most affect the joint strength.