Technology for advanced high-performance microprocessors
Technology for advanced high-performance microprocessors
复制标题
先进高性能微处理器技术
DOI：
10.1109/16.661223
复制
发表时间：
1998
影响因子：
3.1
通讯作者：
Y. El
中科院分区：
文献类型：
--
作者：
M. Bohr;Y. El
本文介绍了逻辑技术的发展，以满足先进的高性能微处理器的密度，性能，功率和制造要求。MOS晶体管尺寸的积极缩放沿着降低的电源提供了具有高性能、低功率和良好可靠性的器件。具有高纵横比的多层平坦化铝互连用于解决互连密度和性能的日益重要性。静态随机存取存储器测试车辆与小型6晶体管单元尺寸用于开发这些逻辑技术，并提供早期的演示的产量和性能能力。制造战略包括开发小组从一开始到早期制造坡道的技术所有权，前一代工艺设备和模块的广泛再利用，以及“精确复制”方法，以确保在多个设施中成功启动和坡道。
This paper describes the development of logic technologies that meet the density, performance, power, and manufacturing requirements for advanced high-performance microprocessors. Aggressive scaling of MOS transistor dimensions along with reduced power supply provide devices with high performance, low power, and good reliability. Multiple layers of planarized aluminum interconnect with high aspect ratios are used to address the increasing importance of interconnect density and performance. Static RAM test vehicles with small 6-transistor cell sizes are used to develop these logic technologies and to provide early demonstrations of yield and performance capabilities. The manufacturing strategy includes development group ownership of the technology from inception to early manufacturing ramp, extensive reuse of prior generation process equipment and modules, and a "copy exactly" methodology to ensure successful process startup and ramp in multiple facilities.