Fast Contour Integral Equation Method for Wideband Power Integrity Analysis
Fast Contour Integral Equation Method for Wideband Power Integrity Analysis
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DOI：
10.1109/tcpmt.2014.2327242
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发表时间：
2014-06
期刊：
影响因子：
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通讯作者：
Huapeng Zhao;E. Liu;Jun Hu;E. Li
中科院分区：
文献类型：
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作者：
Huapeng Zhao;E. Liu;Jun Hu;E. Li
轮廓积分方程方法已用于电子封装的系统级电源完整性分析。但是，复杂封装结构的宽带仿真需要快速轮廓积分方程 (CIE) 方法。为此，我们提出了先验和后验方法来加速 CIE 方法，以实现电源接地层的快速宽带仿真。首先，加速是通过先验方法实现的，即使用 Hankel 函数插值进行快速矩阵填充。其次，将使用基于矢量拟合的自适应频率采样的后验方法与 CIE 方法相结合，以进行快速宽带分析。我们特别提出了一种自动频带分割算法来限制矢量拟合模型的阶数并确保模型快速收敛。提出了数值和实验结果来验证所提出的加速技术的准确性并证明其效率。
The contour integral equation method has been used for system-level power integrity analysis of electronic packages. But, wideband simulation of complex package structures necessitates a fast contour integral equation (CIE) method. For this purpose, we propose both a priori and a posteriori approaches to speed up the CIE method for fast wideband simulation of power ground planes. First, the speedup is achieved by means of a priori approach, i.e., fast matrix filling using Hankel function interpolation. Second, a posteriori approach using the vector-fitting-based adaptive frequency sampling is combined with the CIE method for fast wideband analysis. We specifically propose an automatic band split algorithm to confine the order of the vector fitting model and ensure fast model convergence. Numerical and experimental results are presented to validate the accuracy and demonstrate the efficiency of the proposed acceleration techniques.