Cyclic Stress Measurement Method Using Grain Size of Grown Grains in Electrodeposited Copper Foil
Cyclic Stress Measurement Method Using Grain Size of Grown Grains in Electrodeposited Copper Foil
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利用电解铜箔生长晶粒粒径的循环应力测量方法
DOI：
10.1299/kikaia.73.1417
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发表时间：
2007
期刊：
影响因子：
--
通讯作者：
S. Kitaoka
中科院分区：
文献类型：
--
作者：
Y. Ono;S. Kitaoka
电镀铜应力的测量方法是利用铜箔中晶粒的生长。晶粒长大是一种热再结晶过程，它受预应变量的影响。由于在大的预应变下有大量的晶粒形核，因此大的剪切应力也会导致同样的效果。在此基础上，我们研究了生长晶粒尺寸的应力依赖性。结果表明，晶粒尺寸服从三参数威布尔分布，在晶粒生长速率r* 达到50%之前，尺度参数g与晶粒尺寸算术平均值d* 呈线性关系。随着剪切应力幅值的增大，平均晶粒尺寸减小。为了测量剪切应力幅值，平均晶粒尺寸，剪切应力幅值，和循环次数之间的关系是实验制定的。此外，即使循环次数未知，测量r* 和d* 也使我们能够估计剪切应力幅值。
The copper electroplating stress measurement method uses the grain growth in copper foil. The grain growth is a kind of thermal recrystallization that is affected by the magnitude of prestraining. Since a lot of grain nucleation occurs at the large prestraining, the large shearing stress should also lead to the same effect. On the basis of the above, we investigate the stress dependence of the grown grain size. We confirmed that the size of grown grains is expressed by the three-parameter Weibull distribution, and the relationship between scale parameter g and arithmetic mean of grain size d* has a linear relationship until the grain growth rate r* reaches 50%. It is also recognized that the mean grown grain size becomes smaller with increasing shearing stress amplitude. To measure the shearing stress amplitude, the relationship between mean grain size, shearing stress amplitude, and the number of cycles is experimentally formulated. Moreover, even if the number of cycles is unknown, measuring both r* and d* enables us to estimate the shearing stress amplitude.