Young's modulus of electroplated Ni thin film for MEMS applications
Young's modulus of electroplated Ni thin film for MEMS applications
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DOI：
10.1016/j.matlet.2004.02.044
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发表时间：
2004-07-01
影响因子：
3
通讯作者：
Milne, WI
中科院分区：
文献类型：
--
作者：
Luo, JK;Flewitt, AJ;Milne, WI
研究了适用于微机电应用的电镀镍（Ni）薄膜的杨氏模量随电镀温度和电流密度的变化规律。发现在低于60 ℃的镀覆温度下杨氏模量约为205 GPa，接近块体Ni的杨氏模量，但在80 ℃下急剧下降至约100 GPa。通过水解包含铵和硫酸根离子被认为是急剧下降的原因。对于在J = 2mA/cm（2）下镀覆的Ni膜，杨氏模量为205GPa，并且随着镀覆电流密度增加到30mA/cm（2），杨氏模量降低到85GPa。结果表明，在低电流密度下，镀速较慢，有足够的时间使镀态Ni原子重新排列形成致密的镀层。在高电流下，镀覆速度高，并且Ni离子的有限质量传输导致较不致密的涂层。(C)2004 Elsevier B.V.保留所有权利。
The Young's modulus of an electroplated nickel (Ni) thin film suitable for microelectromechanical applications has been investigated as a function of process variables: the plating temperature and current density. It was found that the Young's modulus is approximately 205 GPa at plating temperatures less than 60 degreesC, close to that of bulk Ni, but drastically drops to approximately 100 GPa at 80 degreesC. The inclusion of ammonium and sulphate ions by hydrolysis is believed to be responsible for the sharp drop. The Young's modulus of 205 GPa is for a Ni film plated at J=2 mA/cm(2) and it decreases to 85 GPa as the plating current density is increased to 30 mA/cm(2). The results imply that at low current density, the plating speed is slow and there is sufficient time for the as-plated Ni atoms to rearrange to form a dense coating. At high currents, the plating speed is high, and the limited mass transport of Ni ions leads to a less dense coating. (C) 2004 Elsevier B.V. All rights reserved.