Low thermal conductivity and high thermoelectric figure of merit in p-type Sb2Te3/poly(3,4-ethylenedioxythiophene) thermoelectric composites
Low thermal conductivity and high thermoelectric figure of merit in p-type Sb2Te3/poly(3,4-ethylenedioxythiophene) thermoelectric composites
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DOI：
10.1063/1.4887504
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发表时间：
2014-07-14
影响因子：
4
通讯作者：
Xiong, Rui
中科院分区：
文献类型：
--
作者：
Zheng, Wenwen;Bi, Peng;Xiong, Rui
将聚（3，4-乙撑二氧噻吩）（PEDOT）嵌入Sb 2 Te 3基体中，制备了p型Sb 2 Te 3/PEDOT热电复合材料。复合材料中Sb_2Te_3的晶粒尺寸为微米级，保持板状。热电性能测试表明，在300-523 K温度范围内，复合材料的热导率kappa值约为0.14 W m（-1）K-1，远低于Sb_2 Te_3化合物的热导率。复合材料的无量纲优值在523 K时达到最大值1.18，为已报道的Sb 2 Te 3/有机复合材料的最高值。结果表明，片状Sb_2Te_3晶粒和嵌埋的PEDOT在降低热导率方面起着重要作用。此外，在室温和523 K之间的50个循环的热循环的结果表明，该复合材料是稳定的，与kappa保持一个较低的值。(C)2014 AIP出版有限责任公司。
p-type Sb2Te3/poly(3,4-ethylenedioxythiophene) (PEDOT) thermoelectric composites are fabricated by embedding PEDOT into Sb2Te3 matrix. The grains of Sb2Te3 in the composites are found to be in micron degree and keep plate-like shapes. The measurements of thermoelectric properties show that the thermal conductivity kappa of the composites is about 0.14 W m(-1) K-1 in the temperature range of 300-523 K, much lower than that of Sb2Te3 compounds. The maximum of dimensionless figure of merit of the composites reaches to 1.18 at 523 K, which is the highest value for the reported Sb2Te3/organic composites. It is suggested that the plate-like Sb2Te3 grains and the embedded PEDOTs may play a significant role in decreasing the thermal conductivity. Furthermore, results of the thermal cycling between the room temperature and 523 K for 50 cycles show that the composites are stable with kappa remaining a low value. (C) 2014 AIP Publishing LLC.